Semiconductor Packaging: A Multidisciplinary Approach (Wiley Professional) download epub
by Robert J. Hannemann,Allan D. Kraus,Michael Pecht
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Semiconductor Packaging book. Start by marking Semiconductor Packaging: A Multidisciplinary Approach as Want to Read: Want to Read savin. ant to Read.
Taking a totalsystem approach to packaging, the book systematically . PHYSICAL ARCHITECTURE OF VLSI SYSTEMS Robert Hannemann, Allan . raus, and Michael Pecht.
Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology.
This examination of VLSI systems describes the interconnection of the microelectronic components, engineering requirements, and mechanical, electrical and materials factors that must be considered in systems design. Various technologies used in electronics design are discussed.
John Wiley & Sons Inc. x, 887 p. Discovery and Innovation Vol. 18(2) 2006: 170-171.
Robert J. Hannemann, Allan D. Kraus and Michael. Michael Pecht; (7) Electronic System Topology. This book with its multidisciplinary nature can. be very useful for electrical, mechanical and soft-. Pecht (eds), John Wiley & Sons, New York, USA, 1994, 887pp. Packaging and interconnection of microelec-. tronic components have become increasingly. ware engineers dealing with electronic system. The book presents an up-to-date, holis-. tic, and pragmatic overview of packaging and.
Vladimirescu, The SPICE Book, Wiley, 1994. 196. R. J. Hannemann, A. D. Kraus and M. Pecht, Semiconductor Packaging : A Multidisciplinary Approach, Wiley, 1997. 197. K. Hintz and D. Tabak, Microcontrollers : Architecture, Implementation and Programming, McGraw-Hill, 1992. 198. F. T. Leighton, Introduction to Parallel Algorithms and Architectures : Arrays, Trees, Hybercubes, Elsevier/MK, 1992.
-Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly o. . Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns
Semiconductor Packaging: A Multidisciplinary Approach. Kraus, M. Pecht. Mechanical Stress Reliability Factors for Packaging GaAs MMIC and LSIC Components.
Semiconductor Packaging: A Multidisciplinary Approach. P. Vidano, D. Paananen, +3 authors Rl Hauser.
In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade.
The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.
Category: Engineering & Transportation
Publisher: Wiley-Interscience; 1 edition (April 1, 1997)
Pages: 904 pages